New Process Monitoring Strategies for Large Area Panel Processing
نویسندگان
چکیده
This paper presents new process monitoring strategies for low cost high density substrates manufactured on large area panels. By increasing the panel size from today’s 4 × 4 inch up to 24 × 24 inch, the EU LAP project is reaching the costs target of US$1/inch for MCM-D substrates. But therefore it is essential to keep the substrate yield on large panels as high as on small panels. With this goal in mind we face complete new monitoring challenges and cost-yield trade-offs. The presented monitoring strategies are laid out to minimise the area consumption, maximise the failure coverage and avoid additional process steps. A case study at the end of the paper shows the benefits in terms of yield and cost when using the new strategies.
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